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Elimination Of Parametric Shifts In Trench MOSFETs Using Low Alpha-Particle Solder

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909885

Authors: Mark A. Gajda, Charles Daniel T. De Leon, Vegneswary A P Ramalingam, Haima Santican

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408326163

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Cites: 11

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Related to: 10