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Novel Residue-Free High-Lead Solder Paste for Power Discrete

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909834

Authors: Jinjin Bai, Yanfang Li, Xinfang Liu, Fen Chen, Yan Liu

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408326165

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Cites: 5

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Related to: 10