Work

A Universal Bonding Strategy for Achieving CMOS‐Compatible Silicon Heterogeneous Integration

Year: 2025

Type: article

Source: Advanced Materials Technologies

DOI: 10.1002/admt.202402063

Authors: Yu Du, Heng Jiang, Bingxuan Zhu, Han Yan, Yao Chai, Chi Chung Tsoi, Xuming Zhang, Chenxi Wang

Institutions: Hong Kong Polytechnic University, Harbin Institute of Technology

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, Hong Kong Polytechnic University

Awards: G1574474281, G1616974612, G2015552011, G2120733317, G2478912089, G2837680846, G2908046932, G3761973838, G4170200233, G4765973452, G574229778, G5796035613, G604931522

OpenAlex ID: W4408384488

FWCI: 0.451

Cites: 61

Cited by: 2

Related to: 10