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Insulation Properties and Design Techniques of Encapsulation Materials for Power Semiconductors

Year: 2025

Type: article

Source: Journal of the Korean Institute of Illuminating and Electrical Installation Engineers

DOI: 10.5207/jieie.2025.39.1.65

Authors: Herie Park, Jae-Eun Hwang, Sanghyo Kim, Su-Ho Lee

Language: English

Topic: High voltage insulation and dielectric phenomena

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408384493

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