Exploring Efficient Thermal Management Solutions for Backside Power Delivery Network (BSPDN) Systems Using Multiscale Modeling
Year: 2025
Type: article
Authors: Feifan Xie, Tiwei Wei
Institution: Purdue University West Lafayette
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4408399530