Work

Solid-state cooling analysis including temperature dependency of thermoelectric material properties

Year: 2025

Type: conference-abstract

Source: Soft Mechatronics and Wearable Systems

DOI: 10.1117/12.3052325

Author: Hee-Seok Kim

Institution: University of Washington Tacoma

Language: English

Topic: Advanced Thermoelectric Materials and Devices

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408445339

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