Work

Analysis and optimization of optical device packaging stress failure based on low temperature environment

Year: 2025

Type: conference-paper

DOI: 10.1117/12.3061774

Authors: XIAOJIE ZHANG, XI ZHEN, MAOSHUN DU, DONGXU ZHANG, RUSHENG PAN

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408507871

FWCI: 2.358

Cites: 5

Cited by: 1

Related to: 10