Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems
Year: 2025
Type: article
Source: Journal of Electronic Packaging
DOI: 10.1115/1.4068209
Institutions: Ericsson (Sweden), AFRY (Sweden)
Language: English
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4408510405
