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Cross-sectional investigation by dual bias modulation electrostatic force microscopy on Si/Si junction fabricated by surface-activated bonding

Year: 2025

Type: article

Source: Japanese Journal of Applied Physics

DOI: 10.35848/1347-4065/adc1d1

Authors: Daichi Kobayashi, Ryota Fukuzawa, Naoteru Shigekawa, Jianbo Liang, Takuji Takahashi

Institutions: The University of Tokyo, Osaka Metropolitan University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408556883

FWCI:

Cites: 43

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Related to: 10