Work

Pulsed laser ablation rates of 4H silicon carbide wafer substrates with nanosecond- and ultrashort-pulse lasers

Year: 2025

Type: conference-paper

DOI: 10.1117/12.3043980

Authors: Terence Hollister, Chandra Nathala, James M. Bovatsek

Institutions: MKS Instruments (United States), Spectra-Physics (Austria)

Language: English

Topic: Laser Material Processing Techniques

Subfield: Computational Mechanics

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408609266

FWCI:

Cites:

Cited by:

Related to: 10