Work

Micro-via processing in glass material using long pulse KrF excimer laser for semiconductor interposer packaging

Year: 2025

Type: conference-paper

DOI: 10.1117/12.3040602

Authors: Yasufumi Kawasuji, Akira Suwa, Yasuhiro Adachi, Tomonari Tanaka, Kouji Kakizaki

Institution: Gigaphoton Inc (Japan)

Language: English

Topic: Laser Material Processing Techniques

Subfield: Computational Mechanics

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408610258

FWCI:

Cites: 7

Cited by:

Related to: 10