Work

Formation of through-glass vias (TGVs) in glass substrates using femtosecond laser operating in MHz/GHz burst mode

Year: 2025

Type: conference-paper

DOI: 10.1117/12.3042970

Authors: Deividas Andriukaitis, Valdemar Stankevič, Evaldas Kažukauskas, Paulius Gečys

Institutions: Ekspla (Lithuania), Vilnius University, Center for Physical Sciences and Technology

Language: English

Topic: Laser Material Processing Techniques

Subfield: Computational Mechanics

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408655530

FWCI: 3.928

Cites: 3

Cited by: 4

Related to: 10