Optimisation of electroless nickel electroless palladium immersion silver (ENEPImAg) surface finish parameters using the Taguchi method for enhanced solder joint reliability
Year: 2025
Type: article
Authors: Rabiatul Adawiyah Mohamed Anuar, Anuar Ismail, Norhasikin Ismail, Ishkrizat Taib, Nur Syamila Abd Latif, Izza Farisha Hamdan, Siti Aisyah A Razak
Institutions: Tun Hussein Onn University of Malaysia, Ohio University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4408674651