Work

Re-Weighted Constrained Feature Characterization Method Study for Flip Chip Solder Joint Vibration Signals

Year: 2024

Type: conference-paper

Source: International Conference on Sensing, Measurement & Data Analytics in the era of Artificial Intelligence (ICSMD)

DOI: 10.1109/icsmd64214.2024.10920592

Authors: Yu Sun, Jiefei Gu, Xinwei Zhao, Michael Pecht, Xixin Chen, Lei Su, Ke Li, Lei Zhang

Institutions: Jiangnan University, China Electronics Technology Group Corporation

Language: English

Topic: Sparse and Compressive Sensing Techniques

Subfield: Computational Mechanics

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, China Postdoctoral Science Foundation, National Key Research and Development Program of China

Awards: G1163691622, G3837694736, G4601848708

OpenAlex ID: W4408700823

FWCI:

Cites: 16

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Related to: 10