Work

Simulation and Experimental Analysis of Contactless Chip Pickup Process Based on a Vortex Flow Gripper

Year: 2025

Type: article

Source: IEEE Transactions on Semiconductor Manufacturing

DOI: 10.1109/tsm.2025.3553559

Authors: Peiran Zhai, Zhoulong Xu, Zhouping Yin, Xiaohang Li, Bin Xie, Hao Wu

Institutions: Huazhong University of Science and Technology, King Abdullah University of Science and Technology

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Pingtung University of Science and Technology, National Key Research and Development Program of China

Award: G6150420632

OpenAlex ID: W4408791143

FWCI: 0.693

Cites: 15

Cited by: 3

Related to: 10