Work

Influence of Harmonics on the Reliability of Press Pack IGBT Devices

Year: 2024

Type: conference-paper

Source: IEEE PES Asia-Pacific Power and Energy Engineering Conference

DOI: 10.1109/appeec61255.2024.10922260

Authors: Huixian Shen, Jun Zhang, Xiong Du, Bing Chen

Institutions: Hohai University, Chongqing University, State Grid Jiangsu Electric Power (China)

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Affordable and clean energy, Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408794688

FWCI:

Cites: 4

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Related to: 10