Enhancing Epoxy Toughness with a Bis-Hydroxy Urethane Diol Additive Derived from CO2-Based Ethylene Carbonate and Bio-Based Diamine
Year: 2025
Type: article
Institution: Seoul National University
Language: English
Topic: Epoxy Resin Curing Processes
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Awards: G2395609478, G6087525832, G6662705040
OpenAlex ID: W4408817501
