The Study on Action Mechanism of 2-Phosphonobutane -1,2,4-Tricarboxylic Acid in Cu Chemical Mechanical Planarization Process
Year: 2025
Type: article
Abstract: In this study, 2-Phosphonobutane -1,2,4-Tricarboxylic acid (PBTCA) was found and utilized as a superior complexing agent in a Cu chemical mechanical polishing (CMP) slurry, which significantly accelerated the dissolution of Cu and increased the removal rate of Cu. The reaction mechanism of PBTCA lies in its ability to react with Cu2+, forming a Cu(II)-PBTCA complex. This process occurs because O atoms on the carboxyl and phosphonic groups form chemical bonds with Cu2+. Molecular dynamics results showed that the complexation ability of the phosphate groups is more potent than that of the carboxylate group. The removal rate of Cu reached 280.6 Å min−1 was obtained in an optimized slurry containing 4 wt% SiO2, 0.6 wt% H2O2, 0.3 wt% PBTCA, and 0.03 wt% 5-Methyl-1H-benzotriazole, while the Sq is 0.82 nm and Ra is 0.106 nm. It meets the needs of the CMP of the low-size Cu interconnection. PBTCA, as a highly efficient and environmentally friendly low-cost complexant, has great application potential in chip manufacturing, especially at a low-technology node.
Authors: Jiangliang Zhang, Jinghui Lai, Guofeng Pan, Yuhang Qi
Language: English
Subfield: Biomedical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: hybrid
Estimated APC paid: $1,950
OpenAlex ID: W4408828629