Work

A Fast Shape Filling Algorithm for Multi-layer PCB

Year: 2024

Type: conference-paper

Source: International Conference on Electronic Information Engineering and Computer Communication (EIECC)

DOI: 10.1109/eiecc64539.2024.10929494

Authors: Zhiyi Sun, Chuandong Chen

Institution: Fuzhou University

Language: English

Topic: VLSI and FPGA Design Techniques

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408851571

FWCI:

Cites: 9

Cited by:

Related to: 10