Work

Codesigned Planar-Packaged THz Transmitter With Integrated CMOS Chip and Folded Reflectarray

Year: 2025

Type: article

Source: IEEE Transactions on Microwave Theory and Techniques

DOI: 10.1109/tmtt.2025.3550168

Authors: Jiawei Yang, Yizhu Shen, Shizhe Xu, Zhenghuan Wei, Sanming Hu

Institutions: State Key Laboratory of Millimeter Waves, Southeast University

Language: English

Topic: Radio Frequency Integrated Circuit Design

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: National Natural Science Foundation of China

Award: G5872588329

OpenAlex ID: W4408858641

FWCI: 0.693

Cites: 41

Cited by: 3

Related to: 10