Work

10-second Cu/Polymer Hybrid Bonding Using Area-Selective Metal Passivation for 3D Integration

Year: 2025

Type: article

Source: IEEE Electron Device Letters

DOI: 10.1109/led.2025.3554768

Authors: Yu-Lun Liu, Tzu-Yu Chen, Kazuaki Ebisawa, Makiko Irie, Ya-Chien Chuang, Hsiao-Wei Yeh, Satoshi Fujimura, Kuan-Neng Chen

Institutions: National Yang Ming Chiao Tung University, Tokyo Ohka Kogyo (Japan)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408859172

FWCI: 0.693

Cites: 8

Cited by: 3

Related to: 10