Work

Design and Implementation of an Electrostatic Force-Based Microcirculation Cooling System for Microelectronic Devices

Year: 2025

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2025.3554926

Authors: Haoxuan Cheng, Lixing Zhou, Chunsheng Guo, Shiwei Feng, Yamin Zhang

Institution: Beijing University of Technology

Language: English

Topic: Heat Transfer and Optimization

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: Scientific Education and Research Foundation, National Natural Science Foundation of China, National Key Research and Development Program of China

Awards: G3638180765, 基于峰值谱技术的GaN基HEMT器件陷阱演化特征及物理机制研究, G6998826950, G8950210697

OpenAlex ID: W4408859885

FWCI: 0.301

Cites: 23

Cited by: 1

Related to: 10