High‐Reliability Simulation for Prediction Water Vapor Barrier Performance in Thin Film Encapsulation with Broad Application Potential
Year: 2025
Type: article
Source: physica status solidi (a)
Authors: Xianwen Liu, Tao Sun, Xuyang Li, Bin Liu, Qi Yao, Shuo Zhang, Feng Wang, Tao Wang, Rui Hong, Zhinong Yu
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Award: G3965318942
OpenAlex ID: W4408866959