Review of Electronic Cooling and Thermal Management in Space and Aerospace Applications
Year: 2025
Type: conference-paper
Abstract: The continuous miniaturization of electronics, high processing capacity, compact microelectronic devices, and high circuit density contribute to an increasing demand for the efficient cooling of electronics. For aerospace and space applications, where packaging and the optimal use of space, weight, and power are important, adequate and efficient cooling is a limiting factor due to the increased heat flux rates from compact-design electronic units. As a technology enabler, thermal management applications become important with the increasing demand for longer component operation times. This study aims to review the literature and the analysis results of thermal engineering applications on cooling of electronics and thermal management approaches in space and aerospace applications. Many advanced cooling applications with interdisciplinary advancements and their benefits are discussed.
Author: Kivilcim Ersoy
Institution: Aselsan (Turkey)
Language: English
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: hybrid
OpenAlex ID: W4408887328