The Effect of Solution Treatment Temperature on The Interface Microstructure and Morphology of SiCp/Al-4.2Cu-4.0Mg Composite
Year: 2025
Type: article
Source: MATERIALS TRANSACTIONS
Authors: Haozhan Wu, Shiming Hao, Pengru Liu, Yutong Liu, Sitong Cai, Jingpei Xie
Language: English
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4408893762
