Work

THE EFFECTS OF INTERMETALLIC COMPOUNDS IN ULTRASONIC-ASSISTED Sn SOLDERING OF Mg/Al ALLOYS

Year: 2025

Type: article

Source: Surface Review and Letters

DOI: 10.1142/s0218625x25400190

Authors: YINGZONG LIU, JINZHE CUI, YUANXING LI, HUI CHEN, ZONGTAO ZHU

Institution: Southwest Jiaotong University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, Sichuan Province Science and Technology Support Program

Awards: G2925828827, G5712285084, G8157236714

OpenAlex ID: W4408906668

FWCI:

Cites: 11

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Related to: 10