Year: 2024
Type: article
Abstract: Thin-layer electrodeposition or electroplating of metals and alloys is essential in the arena of macro-, micro-and nano-optics, optoelectronics, sensors, nanotechnology, automobile industry, energy, electrocatalysis and related fields.To enter this modern ever-evolving field of practical knowledge, this article provides basic considerations on the electroplating processes with utility for practitioners of deposition and researchers entering this field of electrochemical deposition.In particular, the following concepts are discussed:1. Fundamental equations of electroplating, 2. Current distribution, 3. Throwing power, 4. Plating from aqueous solutions, 5. Plating from non-aqueous solutions, 6. Electroplating of alloys, 7. Electroless deposition of metals, 8. Charge transfer in metal deposition, and 9. Environmental aspects of electrodeposition.Key references are also included.
Author: C A C Sequeira
Institutions: University of Lisbon, Instituto Superior Técnico
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: diamond
OpenAlex ID: W4408953415