Copper Mesh Ground Planes for 3D-Printed Substrates
Year: 2025
Type: conference-paper
Authors: Patrick Bartley, Nicholas Lawrence, Nghia Nguyen-Trong, Christophe Fumeaux
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4408955386
