Work

Reliability analysis and parameter optimisation of board-level BGA packaging structures under thermal-drop impact load

Year: 2025

Type: article

Source: Soldering and Surface Mount Technology

DOI: 10.1108/ssmt-01-2025-0003

Authors: Yanxi Sun, Zixin Zhen, Xuexia Yang, Miao Zhu, Chao Chang

Institution: Taiyuan University of Science and Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408990380

FWCI: 0.68

Cites: 10

Cited by: 3

Related to: 10