Improving the memory window of a ferroelectric thin film transistor using an atomic layer deposited HfN x interfacial layer
Year: 2025
Type: article
Abstract: This work examines the impact of atomic-layer-deposited 1-nm-thick HfN x interfacial layer and NH 3 annealing on the ferroelectric properties of Hf 0.5 Zr 0.5 O 2 capacitors and ferroelectric thin-film transistors with an amorphous InGaZnO channel.
Source: Journal of Materials Chemistry C
DOI: 10.1039/d5tc00453e
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: hybrid
Awards: G6661820739, G7208142174
OpenAlex ID: W4409082710
