Work

Exploring Chemical Catalytic Mechanisms for Enhancing Bonding Energy in Direct Silicon Dioxide Wafer Bonding

Year: 2025

Type: article

Abstract: The influence of pH on silicon dioxide direct bonding is studied, unveiling its role in bonding energy enhancement. We show that the deposition of basic salt or molecules consistently increases the silicon dioxide adherence energy. The underlying mechanisms, including silica hydrolysis and catalysis of siloxane bond formation, are explored. The results offer valuable insights into optimized direct bonding processes for microelectronics and related applications.

Source: Applied Sciences

DOI: 10.3390/app15073883

Authors: Aziliz Calvez, Vincent Larrey, Paul Noël, François Rieutord, Frank Fournel

Institutions: Commissariat à l'Énergie Atomique et aux Énergies Alternatives, CEA Grenoble, Laboratoire d'Électronique des Technologies de l'Information, Université Grenoble Alpes, Soitec (France)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: gold

Estimated APC paid: $2,896

OpenAlex ID: W4409088672

FWCI: 2.034

Cites: 58

Cited by: 9

Related to: 10