Work

Optical Setup for Laser-Assisted Bonding With Through-Silicon Microscopy Capabilities

Year: 2025

Type: article

Abstract: The modern processes for photonic integration impose stringent demands on the design and functionality of high precision bonding assembly setups. In this study, we present the development of a Laser Assisted Bonding (LAB) setup employing bottom irradiation/illumination architectures. The main goal is to demonstrate through-silicon imaging capability enabling alignment of photonic waveguides during the LAB process. The imaging is achieved with a novel optical set-up used also for the simultaneous irradiation laser beam delivery. A proof-of-concept LAB integration of a III/V chip to silicon photonic integrated circuit is demonstrated.

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2025.3557118

Authors: Aleksandr A. Vlasov, Topi Uusitalo, Evgenii Lepukhov, Jukka Viheriälä, Mircea Guina

Institutions: Tampere University, University of Tampere

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: hybrid

Estimated APC paid: $2,645