Semi-curing combined with low-pressure mechanical pressing strategy for realizing high adhesion and low surface roughness Ag-NW transparent electrodes
Year: 2025
Type: article
Source: Journal of Materials Chemistry A
DOI: 10.1039/d5ta00523j
Authors: Yiwen Du, Mohan Li, Yingying Kang, Ying Sui, Longlong Huang, Hui Wang, Ling Ye, Zhi Yang, Huagui Nie, He Huang, Yongjie Ge
Institution: Wenzhou University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4409100209