Work

Ultra-heat resistance and low CTE polyimides with spirobis(indene)bis(benzoxazole)-benzimidazole unite for flexible substrate applications

Year: 2025

Type: article

Abstract: The advancement of new technologies has driven the demand for the development of higher-performance polyimides (PI), especially in terms of heat resistance, dimensional stability, and mechanical properties. In this study, four highly rigid, twisted diamine isomers featuring a spirobis(indene)bis(benzoxazole) structure were synthesized. By their co-polycondensation with 5-amino-2-(4-aminobenzene)-benzimidazole (PABZ) and 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA) followed by thermal imidization, a series of PIs with benzoxazole and benzimidazole structures were prepared. Owing to the rigid and linear structure and the formation of intermolecular hydrogen bonding, the PI films showed ultrahigh heat resistance (Tg: 417-510°C; Td5% = 514-562°C) and excellent dimensional stability (CTE: 2.1-23.5 ppm/K). Meanwhile, they also demonstrate excellent mechanical properties, with a tensile strength of up to 238.5 MPa and an initial modulus of up to 6.8 GPa. These polyimide films have great application potential in flexible display substrates.

Source: European Polymer Journal

DOI: 10.1016/j.eurpolymj.2025.113923

Authors: Peng Xiao, Xiaojie He, Qinghua Lu

Institutions: Tongji University, Ningbo University of Technology, Shanghai Jiao Tong University

Language: English

Topic: Synthesis and properties of polymers

Subfield: Polymers and Plastics

Field: Materials Science

Domain: Physical Sciences

Open Access status: hybrid

Estimated APC paid: $4,330

Funders: National Natural Science Foundation of China, Ningbo University of Technology