Work

Thermal-Torsion Coupling Loading Analysis and Optimization of 3-D PoP Assembly Solder Joints at Different Temperatures

Year: 2025

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2025.3548413

Authors: Chao Gao, Chunyue Huang, Ying Liang, Chen Dian, Jingyi Lan, Gui Wang

Institutions: Guilin University of Electronic Technology, Chengdu University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Natural Science Foundation of China

Award: G4868524918

OpenAlex ID: W4409126818

FWCI: 0.911

Cites: 21

Cited by: 4

Related to: 10