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Direct RF FPGAs Built with Multi-Chip Packaging Overcome Technology Challenges

Year: 2024

Type: conference-paper

Source: IEEE High Performance Extreme Computing Conference

DOI: 10.1109/hpec62836.2024.10938522

Authors: Marjorie Catt, Dustin Henderson

Institution: Intel (United States)

Language: English

Topic: Radio Frequency Integrated Circuit Design

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4409132070

FWCI: 0.806

Cites: 2

Cited by: 1

Related to: 10