Innovative Thermal Solutions for 3D Heterogeneous Integration of Co-Packaged Optics
Year: 2024
Type: conference-paper
Authors: Tianhao Zhang, Guoli Yin, Wenbo Xia, Norman Chang, Lang Lin, Huangjin Zhao, Qinglian Li
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4409156083