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Breakdown Criteria Selection for Analyzing Advanced Node High-K TDDB Stress Data

Year: 2024

Type: conference-paper

Source: IEEE International Integrated Reliability Workshop final report

DOI: 10.1109/iirw62856.2024.10947138

Authors: Byung-Hwan Chu, Barry P. Linder, Baozhen Li, Giuseppe La Rosa

Institutions: IBM (United States), IBM Research - Thomas J. Watson Research Center

Language: English

Topic: Semiconductor materials and devices

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4409156106

FWCI:

Cites: 11

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Related to: 10