Work

Grain effect, creep analysis, and machine learning of Sn-3Ag-0.5Cu solder joint of BGA package under thermal shock test

Year: 2025

Type: article

Source: Engineering Failure Analysis

DOI: 10.1016/j.engfailanal.2025.109588

Authors: Weitong Sun, Xinyi Jing, Liqiang Cao, Peng He, Shuye Zhang

Institutions: Harbin Institute of Technology, Chinese Academy of Sciences, Institute of Microelectronics

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: Chinese Academy of Sciences, Key Laboratory of Silicon Device Technology

Award: G3972917333

OpenAlex ID: W4409264342

FWCI: 2.72

Cites: 30

Cited by: 12

Related to: 10