Work

Investigation of tilted etching of Si3N4 using CF4/O2 plasma: Process development and mechanism study

Year: 2025

Type: article

Source: Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena

DOI: 10.1116/6.0004412

Authors: Zhihong Gao, Leyi Zhang, Yongzhi Fang, Dongyu Cen, Maoxiang Liu, Wenli Wu, Yan Ding

Institution: Jiangnan University

Language: English

Topic: Plasma Diagnostics and Applications

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4409282305

FWCI: 0.462

Cites: 22

Cited by: 2

Related to: 10