High-temperature insulating polyimide aerogels with a hierarchical porous hyper-cross-linked structure derived from aqueous polymerization of mesostructured silica-grafted Poly(amic acid) salt
Year: 2025
Type: article
Abstract: Polyimide (PI) aerogels have garnered significant interest in thermal protection applications because of their excellent high-temperature resistance and broad operational range. Nevertheless, there are still research challenges, such as the extensive use of organic solvents, shrinkage during drying, and the need for improved thermal/electrical insulation and mechanical properties. Addressing these challenges is crucial for enhancing the practical application of PI aerogels in demanding environments. Herein, we propose a facile, green, and scalable method for fabricating freeze-dried PI aerogels via the aqueous polymerization of amino-functionalized mesoporous silica-grafted poly(amic acid) salts (PAAS- g -AMS). Our findings demonstrate that water-borne PI (W-PI)- g -AMS aerogels have a three-dimensional covalent network with a macroporous/mesoporous architecture, which minimizes molecular chain slippage and shrinkage during thermal imidization. The W-PI- g -AMS aerogels possess excellent properties, such as high porosity (>91 %), a low bulk density (122.4 mg cm −3 ), minimal shrinkage (8.1 %), good compressive strength (6.15 MPa) and modulus (1.86 MPa), a high degradation temperature ( T d5 % = 599.4 °C), a low fire growth rate index (0.075 W g −1 s −1 ), low thermal conductivity (0.08241 W m −1 K −1 ), and a remarkably low dielectric constant ( D k = 1.25 at 1 MHz) and dissipation factor ( D f = 0.001 at 1 MHz), indicating their potential for use as substitute materials for thermal and electrical superinsulation in the aerospace and transportation industries in extreme environments. • A green and scalable method for fabricating water-borne PI aerogels was developed through the aqueous polymerization of PAAS-g-AMS. • The W-PI-g-AMS aerogels feature a 3D covalent network that minimizes chain slippage and shrinkage during thermal imidization. • The W-PI-g-AMS aerogels demonstrated high thermal and electrical insulation performance under extreme environmental conditions.
Source: Polymer Testing
Authors: Jae Hui Park, Seeun Jang, Young Nam Kim, Jaewon Choi, Hyeonuk Yeo, Ki-Ho Nam
Language: English
Subfield: Spectroscopy
Field: Chemistry
Domain: Physical Sciences
Open Access status: gold
Estimated APC paid: $3,370
Awards: G4897068800, G5028849516
OpenAlex ID: W4409290661
