Work

Cold plasma‐mediated kapok fiber/epoxy composites for printed circuit board applications

Year: 2025

Type: article

Source: Polymer Composites

DOI: 10.1002/pc.29920

Authors: Ramyaranjan Das, Dhaneshwar Prasad Sahu, Basanta Kumar Parida, Mukesh Ranjan, Dillip Kumar Bisoyi

Institutions: National Institute of Technology Rourkela, Institute for Plasma Research

Language: English

Topic: Natural Fiber Reinforced Composites

Subfield: Polymers and Plastics

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4409380969

FWCI: 2.305

Cites: 54

Cited by: 10

Related to: 10