Work

Broadband Characterization of Interconnects in Die-Embedded Glass Interposer

Year: 2025

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2025.3548082

Authors: Serhat Erdogan, Xiaofan Jia, Xingchen Li, Mohanalingam Kathaperumal, Ravi Agarwal, Madhavan Swaminathan

Institutions: Georgia Institute of Technology, Meta (United States), Pennsylvania State University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4409395273

FWCI: 0.693

Cites: 17

Cited by: 3

Related to: 10