A Study on the Compaction Behavior and Parameter Sensitivity of Curing Phenolic Thermal Protection Material Strips
Year: 2025
Type: article
Abstract: This study investigates the curing and compaction behavior of filament-wound phenolic thermal protection materials. The optimal heating profile was determined based on curing kinetics obtained through DSC analysis. A Box-Behnken design was employed to evaluate the effects of curing temperature, pressure, and heating rate on the fiber volume fraction. Microscopic analysis revealed the evolution and gradient distribution of voids during the curing process. A regression model was established, and sensitivity analysis revealed that curing pressure had the greatest influence, followed by heating rate and temperature. These findings offer insights into void control mechanisms and process optimization strategies for high-performance phenolic composites.
Source: Polymers
Authors: Xiaodong He, Zeyu Pan, Hualian Li
Institution: Inner Mongolia University of Technology
Language: English
Topic: Epoxy Resin Curing Processes
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: gold
Estimated APC paid: $3,258
Awards: G1328130669, G658959145
OpenAlex ID: W4409407775