Work

Effective Improvement of Chemical Mechanical Polishing for Silicon Wafers Using Nitrogen-Containing Heterocyclic Compounds Slurry

Year: 2025

Type: article

Source: ECS Journal of Solid State Science and Technology

DOI: 10.1149/2162-8777/adcc53

Authors: Haitao Wu, Zefang Zhang, Jiuwei Bai, Tianhang Yang, Yufei Zhang, Tong Liu, Gong Lv, Kaiyue Wang

Institution: Taiyuan University of Science and Technology

Language: English

Topic: Advanced Surface Polishing Techniques

Subfield: Biomedical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4409423419

FWCI: 0.241

Cites: 30

Cited by: 1

Related to: 10