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Wafer-Level Fabrication of FAIMS Chips Based on TGV Technology

Year: 2025

Type: article

Source: Journal of Microelectromechanical Systems

DOI: 10.1109/jmems.2025.3554629

Authors: Zhengrui Hu, Han Wang, Shan Li, Youjiang Liu, Chunjing Xu, Shaomin Liu, Jianhui Wei, Chilai Chen

Institutions: University of Science and Technology of China, Chinese Academy of Sciences, Hefei Institutes of Physical Science, Institute of Intelligent Machines

Language: English

Topic: Mass Spectrometry Techniques and Applications

Subfield: Spectroscopy

Field: Chemistry

Domain: Physical Sciences

Open Access status: closed

Funders: National Key Research and Development Program of China, Fundamental Research Funds for the Central Universities

Award: G5725636296

OpenAlex ID: W4409426214

FWCI: 0.76

Cites: 33

Cited by: 3

Related to: 10