Work

Overview of Testing Methods for Mechanical and Adhesion Properties of Materials in Semiconductor Packages

Year: 2025

Type: article

Source: IEEE Transactions on Materials for Electron Devices

DOI: 10.1109/tmat.2025.3561740

Authors: Seung Jin Oh, Jae Hak Lee, Seung Man Kim, Seongheum Han, Ah-Young Park, Hyunkyu Moon, Jun-Yeob Song

Institutions: Korea Institute of Machinery & Materials, University of Seoul

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: Ministry of Trade, Industry and Energy, National Research Foundation of Korea

OpenAlex ID: W4409494394

FWCI: 0.693

Cites: 134

Cited by: 3

Related to: 10