Optimization of the Reliability of Ball Grid Array Solder Joints Under Random Vibration Conditions Using an Improved Back Propagation Neural Network-Based Particle Swarm Algorithm
Year: 2025
Type: article
Source: Journal of Electronic Packaging
DOI: 10.1115/1.4068450
Authors: Miao Zhu, Xuexia Yang, Yanxi Sun, Jinbao Lin, Erqiang Liu, Ze Wang
Institution: Taiyuan University of Science and Technology
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Award: G1784661915
OpenAlex ID: W4409538989