Work

Evaluation of Phase Transformation on Boron Decorated Sn-1.5Ag-0.7 Cu Joined Cu Pillar for Packaging Connection

Year: 2025

Type: article

Source: Journal of Electronic Packaging

DOI: 10.1115/1.4068448

Authors: Ching-Yuan Ho, Haw-Teng Lee

Institution: National Cheng Kung University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4409539722

FWCI: 0.231

Cites: 15

Cited by: 1

Related to: 10