Bi, Ni and Ce coaddition improving shear property and interfacial growth of SAC305 solder joint on Cu substrate
Year: 2025
Type: article
Abstract: In this study, the shear property and interfacial growth of Sn-3.0Ag-0.5Cu (SAC305) and Sn-3.0Ag-0.5Cu-3Bi-0.05Ni-0.05Ce (SAC305-BNC) solder joints on Cu substrates during isothermal aging were investigated. The coaddition of Bi, Ni and Ce evidently enhanced shear strength of SAC305 alloy whether after aging or not, and changed the shear fracture from a transgranular failure to an intergranular failure. Cu 6 Sn 5 intermetallic compound (IMC) layer formed in the SAC305/Cu solder joints, (Cu,Ni) 6 Sn 5 and Cu 3 Sn IMC layers formed in the SAC305/Cu solder joints. The growth rates of IMC layers were slowed, and the Cu 6 Sn 5 grain size were refined by Bi, Ni and Ce coaddition during isothermal aging, thereby partly contributing to the increase of shear strength, and simultaneously improving the reliability of solder joints.
Source: Microelectronics Reliability
Authors: Mi Wu, Li Fu, Lei Li, Peng Gao, Yingde Miao, Qian Zhou, Qiong Lu, Caiju Li
Institution: Kunming University of Science and Technology
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: hybrid
Estimated APC paid: $2,280
Awards: G5480470984, G6005494285, G7044603987
OpenAlex ID: W4409587943